Symposium

A. Cryogenic plasma and low temperature etching technology

A-1. Cryogenic etching processes of silicon (deep etching...)

A-2. Cryogenic etching of dielectrics (3D NAND...)

A-3. Cryo-atomic layer etching

A-4. Conventional plasma etching techniques

A-5. Modeling and simulation of plasma etching processes

B. Plasma technology

B-1. Plasma for agriculture and biomedical applications

B-2. Plasma for catalysis and nano-processes

B-3. Plasma for environmental issues (e.g. water and gas treatment, recycling)

B-4. Plasma simulation and modeling

B-5. Scrape-off Layer (SOL)/diverter plasmas and plasma-wall interactions (PWI)

B-6. Data-driven, green digital transformation (DX) plasma

C. Thin film and coating technology for sustainable development goals

C-1. Surface engineering (PVD, CVD; spraying, nitriding, and others) to achieve progress in energy saving, harvesting, carbon reduction, and sustainable development goals.

C-2. Low-impact materials (non-toxic, recycled materials) for the surface and intermediate steps

C-3. Thin film and coating technology for advanced semiconductors, carbon materials, and nanomaterials

C-4. Thin film and coating technology for biomaterials, optical materials

C-5. Thin film and coating technology for protective, anti-corrosion, high-temperature, and severe environment applications

SC. Short course:

IPTJC2025 will invite renowned international scholars recommended by the American Vacuum Society (AVS), Global Plasma Forum, and PlaCEP to conduct a six-hour short course on the first day of the conference. The course aims to provide educational training for participants in professional technical areas including plasma technology, thin film technology, and materials analysis techniques.